Video Gallery
Equipment can be used for variable situations. Here comes sample video for machine we have made.
Eutectic Die Bonding Machine
49sec
- Welding material fed by flexible feeder;
- Chips fed by wafer blue tape;
- Shell fed by tray;
- Nitrogen protection;
- Max temperature 450° ±1°
Die Sorter: wafer to tape and reel
30sec
- Speed can be over 8K per hour
- Carrier tape width can be adjusted
- Sealing temperature/pressure can be adjusted
- 12inch wafer campatible with 8 inch
COB flip
1min 27sec
- Dual platform;
- Wafer autoloading by magazine;
- Tray autoloading;
- Output to conveyor
Epoxy die bonder
1min 16sec
- Customized epoxy route drawing
Die bonding machine
53sec
- 3mil;
- small red light;
- fast and accuracy without pressing;
- 45 ms for cycle